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 HD74LS145
BCD-to-Decimal Decoder / Driver (with 15 V outputs)
REJ03D0436-0300 Rev.3.00 Jul.13.2005 This BCD-to-decimal decoder / driver consists of eight inverters and ten four-input NAND gates. The inverters are connected in pairs to make BCD input data available for decoding by the NAND gates. Full decoding of valid BCD input logic ensures that all outputs remain off for all invalid binary input conditions. This decoder features highperformance, n-p-n output transistors designed for use as indicator / relay drivers or as open-collector logic-circuit drivers.
Features
* Ordering Information
Part Name HD74LS145P HD74LS145FPEL Package Type DILP-16 pin SOP-16 pin (JEITA) Package Code (Previous Code) PRDP0016AE-B (DP-16FV) PRSP0016DH-B (FP-16DAV) Package Abbreviation P FP Taping Abbreviation (Quantity) -- EL (2,000 pcs/reel)
Note: Please consult the sales office for the above package availability.
Pin Arrangement
Y0 Y1 Y2 Outputs Y3 Y4 Y5 Y6 GND
1 0 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 9 D C B A
16 15 14 13 12 11 10 9
VCC A B Inputs C D Y9 Y8 Y7 Outputs
(Top view)
Rev.3.00, Jul.13.2005, page 1 of 5
HD74LS145
Function Table
No. 0 1 2 3 4 5 6 7 8 9 D L L L L L L L L H H H H H H H H Inputs C B L L L L L H L H H H H H L L L L H H H H L L H H L L H H L L H H A L H L H L H L H L H L H L H L H 0 L H H H H H H H H H H H H H H H 1 H L H H H H H H H H H H H H H H 2 H H L H H H H H H H H H H H H H 3 H H H L H H H H H H H H H H H H Outputs 4 5 H H H H H H H H L H H H H H H H H H H H H L H H H H H H H H H H 6 H H H H H H L H H H H H H H H H 7 H H H H H H H L H H H H H H H H 8 H H H H H H H H L H H H H H H H 9 H H H H H H H H H L H H H H H H
Invalid
Block Diagram
A Y0 Y1 Y2 B Inputs Y4 Outputs C Y5 Y6 D Y7 Y8 Y9 Y3
Absolute Maximum Ratings
Item Supply voltage Input voltage Power dissipation Storage temperature Symbol VCC VIN PT Tstg Ratings 7 7 400 -65 to +150 Unit V V mW C
Note: Voltage value, unless otherwise noted, are with respect to network ground terminal.
Rev.3.00, Jul.13.2005, page 2 of 5
HD74LS145
Recommended Operating Conditions
Item Supply voltage Off-state output voltage Low level output current Operating temperature Symbol VCC VO(off) IOL Topr Min 4.75 -- -- -20 Typ 5.00 -- -- 25 Max 5.25 15 80 75 Unit V V mA C
Electrical Characteristics
(Ta = -20 to +75 C)
Item Input voltage Off-state output current On-state output voltage Symbol VIH VIL IO(off) min. 2.0 -- -- -- -- -- -- -- typ.* -- -- -- -- -- -- -- -- max. -- 0.8 250 0.4 0.5 3.0 20 -0.4 Unit V V A Condition
VO(on) IIH IIL
V A mA
Input current
VCC = 4.75 V, VIH = 2 V, VIL = 0.8 V, VO(off) = 15 V IOL = 12 mA VCC = 4.75 V, VIH = 2 V, IOL = 24 mA VIL = 0.8 V IOL = 80 mA VCC = 5.25 V, VI = 2.7 V VCC = 5.25 V, VI = 0.4 V VCC = 5.25 V, VI = 7 V VCC = 5.25 V VCC = 4.75 V, IIN = -18 mA
-- -- 0.1 mA II Supply current** ICC -- 7 13 mA Input clamp voltage VIK -- -- -1.5 V Notes: * VCC = 5 V, Ta = 25C ** ICC is measured with all outputs open and all inputs grounded.
Switching Characteristics
(VCC = 5 V, Ta = 25C)
Item Propagation delay time Symbol tPLH tPHL min. -- -- typ. -- -- max. 50 50 Unit ns Condition CL = 45 pF, RL = 665
Rev.3.00, Jul.13.2005, page 3 of 5
HD74LS145
Testing Method
Test Circuit
VCC Output
4.5V A B C D
0 1 2 3 4 5 6 7 8 9
RL
Input P.G. Zout = 50
See Testing Table
CL
Waveform
tTLH 90% 1.3 V 10% tPLH tTHL 90% 1.3 V 10% tPHL VOH In phase output tPHL 1.3 V tPLH VOH Out of phase output 1.3 V 1.3 V VOL 1.3 V VOL 3V 0V
Input
Note:
Input pulse; tTLH 15 ns, tTHL 6 ns, PRR = 1 MHz, duty cycle 50%
Rev.3.00, Jul.13.2005, page 4 of 5
HD74LS145
Package Dimensions
JEITA Package Code P-DIP16-6.3x19.2-2.54 RENESAS Code PRDP0016AE-B Previous Code DP-16FV MASS[Typ.] 1.05g
D
16
9
1 0.89 b3
8
Z
E
A1
A
Reference Symbol
Dimension in Millimeters Min Nom 7.62 19.2 6.3 20.32 7.4 5.06 0.51 0.40 0.48 1.30 0.19 0 2.29 2.54 0.25 0.31 15 2.79 1.12 2.54 0.56 Max
e D E
L
1
A A1
e
bp
e1
b c b c
p 3
e Z ( Ni/Pd/Au plating ) L
JEITA Package Code P-SOP16-5.5x10.06-1.27
RENESAS Code PRSP0016DH-B
Previous Code FP-16DAV
MASS[Typ.] 0.24g
*1
D F 9
16
NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET.
bp
HE
E
Index mark
Reference Symbol
*2
c
Dimension in Millimeters Min Nom 10.06 5.50 Max 10.5
Terminal cross section ( Ni/Pd/Au plating )
1 Z e
*3
D E A2
8 bp x M L1
A1 A bp b1 c
0.00
0.10
0.20 2.20
0.34
0.40
0.46
0.15
1
0.20
0.25
A
c
HE
0 7.50 7.80 1.27
8 8.00
A1
y L
e x y
0.12 0.15 0.80 0.50
1
Detail F
Z L L 0.70 1.15
0.90
Rev.3.00, Jul.13.2005, page 5 of 5
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> 2-796-3115, Fax: <82> 2-796-2145
http://www.renesas.com
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(c) 2005. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .3.0


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